Your Link Between Data and Decision




  • Shape Matching

  • Correlation

  •  High Volume Testing

Neil Hubble from Akrometrix at the APEX show 2014 
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The TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample's behavior during a user-defined thermal profile.

The combination of shadow moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré AXP, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies.

The TherMoiré AXP is an expandable modular metrology platform:

  • Up to 400 mm x 400 mm maximum sample size
  • Acquisition of 1.4 million displacement data points in less than 2 seconds
  • Enhanced temperature uniformity convective heating and cooling
  • High resolution measurement of small form factor samples
  • XYZ axis strain and CTE calculation
  • Increased lab productivity with advanced, powered cooling
  • Support for reliability testing from -50°C to 150°C+ and reflow simulation to 280°C+
  • Multiple part testing for increased throughput


The TherMoiré AXP is powered by Akrometrix's Studio 7.2 Software which includes the following modules:

  • Studio Manager
  • Profile Generator
  • Surface Measurement
  • Thermal Profiler
  • Surface Analysis
  • Report Generator
  • Digital Fringe Projection (DFP) Surface Measurement (optional)
  • Digital Image Correlation (DIC) Surface Measurement (optional)


The TherMoiré AXP can be used for a variety of laboratory applications:

  • Pb-Free processing implementation
  • Pre-production mechanical behavior qualification
  • Evaluation of different materials and constructions
  • Failure/defect analysis
  • Validation of computer modeling
  • Reflow profile simulation and optimization
  • Supplier performance and conformity monitoring
  • Evaluation of component-substrate seating plane interconnect


The TherMoiré AXP can also used on the production floor:

  • Quality assurance/quality control
  • Lot-to-lot trending analysis
  • Real-time process monitoring
  • Statistical process control (SPC) analysis
  • Supplier performance and conformity monitoring


The TherMoiré AXP Optional Modules provide advanced measurement, processing and throughput capability:

  • Digital Image Correlation (DIC) Module
  • Digital Fringe Projection (DFP) Module
  • Convective Module
  • CoolBoost Module



New software that enables 3D, 2D, and statistical review of a complete interface. Users can now visualize and quantify exactly how two surfaces will mate together.

  • Die to Package Design
  • Package on Package
  • Package to PCB
  • Computer Modeling Validation
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Process Optimization

Using our systems can dramatically reduce the failure rate during reflow and can help to increase your revenue and yield.