TherMoiré Platform

Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for use as a laboratory tool, today's generation of TherMoiré product offerings serves as the platform for an enterprise-wide warpage management solution. Innovative developments in hardware, software and data management make the TherMoiré an essential value-added component for microelectronics manufacturing around the world.

Development / Diagnostics / Production Monitoring. Whether your customer is the individual consumer or an OEM, the TherMoiré excels at helping you achieve exceptional customer satisfaction. Better than ever, TherMoiré technology can simulate your thermal processing and operating environment conditions, while capturing a complete history of out-of-plane displacement behavior. Applying this critical information to form - or achieve compliance for - component/substrate behavior allowances (i.e. warpage specifications) can directly impact level I and level II assembly yields and enhance product reliability.

TherMoiré In-Process Warpage Measurement Systems

  • Dynamic Temperature Profiling - temperature ranges from -50°C to 300°C
  • Modular Metrology - Shadow Moiré, Digital Image Correlation, Digital Fringe Projection
  • Automated Analyses - Bow, Twist, Coplanarity, Signed Warpage, CTE, Surface Tilt, etc.
  • Data Management - Centralized database tools for production monitoring, trending and customer conformity/assurance requirements.

All of the above combine to provide users with a low cost per test, a clear ROI and a platform for long-term, value-added functionality across both development and production operations.

CXP Platform

The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution of 5 microns. The CXP use the same Studio software used to run the Akrometrix TherMoiré platforms.

The CXP uses a convection oven for heating and cooling and includes a 2MP camera and projector for DFP measurements. The CXP oven can hold samples up to 300x300mm in size and the 64x48mm field of view is movable around the full oven 300x300mm field of view through a sliding gantry.

The CXP provides a cost effective solution for customers looking to adhere to the IPC 9641 industry standard concerning measuring local board warpage.